伪静态随机存储器(PSRAM)-HyperRAM-英飞凌(Infineon)官网
HYPERRAM™ - 外形小巧的低引脚数、高带宽pSRAM
HYPERRAM™是具备HyperBus™ 接口的高速CMOS自刷新DRAM。 其存储阵列的内部结构类似于DRAM,而外在行为则与SRAM相似。
DRAM阵列需要定期刷新以保持数据完整性。HyperRAM™可在主机未进行主动读取或写入存储器时,从内部实现DRAM阵列刷新操作。由于主机无需执行任何刷新操作,因此,在主机看来DRAM阵列是静态单元,可以保留数据而无需刷新。所以,HYPERRAM™被称为伪静态随机存储器 (PSRAM) 。
这些低功率、高性能、低引脚数pSRAM适用于需要额外的RAM来缓冲数据、音频、图像和视频等的应用,或者需要扩展存储器用作便笺式存储器,以进行数据密集型计算的应用。
密度:64Mb、128Mb、256Mb、512Mb
接口:HyperBus™(x8)、Octal xSPI(x8) 和HyperBus™ Extended I/O (x16)
HYPERRAM™ - 外形小巧的低引脚数、高带宽pSRAM
HYPERRAM™是具备HyperBus™ 接口的高速CMOS自刷新DRAM。 其存储阵列的内部结构类似于DRAM,而外在行为则与SRAM相似。
DRAM阵列需要定期刷新以保持数据完整性。HyperRAM™可在主机未进行主动读取或写入存储器时,从内部实现DRAM阵列刷新操作。由于主机无需执行任何刷新操作,因此,在主机看来DRAM阵列是静态单元,可以保留数据而无需刷新。所以,HYPERRAM™被称为伪静态随机存储器 (PSRAM) 。
这些低功率、高性能、低引脚数pSRAM适用于需要额外的RAM来缓冲数据、音频、图像和视频等的应用,或者需要扩展存储器用作便笺式存储器,以进行数据密集型计算的应用。
密度:64Mb、128Mb、256Mb、512Mb
接口:HyperBus™(x8)、Octal xSPI(x8) 和HyperBus™ Extended I/O (x16)。
关键特性
- 外形小巧 – FBGA封装确保了较小的占板空间
- 低引脚数 – 低引脚数有助于简化设计并降低系统成本
- 低功耗 – 混合睡眠模式和部分阵列刷新可提高能效
- 高吞吐量 – 高读/写带宽能最大限度地提高系统性能
HyperBus™是一种低信号数DDR接口,可实现高速读写吞吐量。它利用一个高速8位DDR接口来支持地址信号和数据信号,以及差分时钟信号、读写锁存信号和芯片选择信号。
HyperBus™还可以支持同一总线上的外部NOR闪存和RAM,并且可以与任何具备兼容HyperBus™的外设接口的单片机配合工作。实现这一点只需要13个引脚用于数据事务信号(12个引脚用于HyperBus™ + 1个额外的芯片选择信号引脚,以支持第二个存储器件 )。
如需了解HyperRAM™如何实现低引脚数扩展存储解决方案,请阅读本白皮书。
HYPERRAM™产品实现的每引脚吞吐量远高于其他竞争性技术,如传统pSRAM和基于并行接口的SDR DRAM。其内置自刷新电路以及诸如部分阵列刷新和混合睡眠模式等低功耗特性,有助于降低功耗,这使得HyperRAM适合用于功率受限的应用,如可穿戴设备和物联网设备。
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最近更新:2022年5月6日
英飞凌直接为我们的合作伙伴给予支持,以确保我们的HYPERBUS™存储器解决方案完全兼容现有的及新的芯片组。得益于此,英飞凌产品可以轻松匹配行业领先制造商生产的芯片组,同时助力客户缩短嵌入式系统设计周期。
可支持HYPERBUS™产品的单片机列表将不断扩充,欢迎经常回来查看。
HYPERBUS™芯片组支持
Partner | Chipset / Platform Name | Application | HyperFlash | HyperRAM |
Infineon |
TRAVEO™ S6J331x | Automotive Cluster | • | • |
TRAVEO™ S6J335x | Automotive Gateway | • | • | |
TRAVEO™ S6J326Cx | Automotive Cluster | • | • | |
TRAVEO™ S6J324Cx | Automotive Cluster | • | • | |
TRAVEO™ S6J327Cx | Automotive Cluster | • | • | |
TRAVEO™ S6J328Cx | Automotive Cluster | • | • | |
TRAVEO™ S6J32DAx | Automotive Cluster | • | • | |
TRAVEO™ S6J32BAx | Automotive Cluster | • | • | |
TRAVEO™ II CYT4BF | Automotive Body | • | • | |
TRAVEO™ II CYT3BB/4BB | Automotive Body | • | • | |
FM4 Family S6E2DH Series | Industrial | • | • | |
Altera/Intel |
MAX10 | Industrial | • | • |
Cyclone 10 LP | Industrial | • | • | |
Faraday Tech |
A600 | IoT | • | • |
GCT | GDM7243i | IoT | • | • |
Gowin Semiconductor | GW1NSR-2C | FPGA, Industrial | • | • |
Greewaves Technologies | GAP8 | Artificial Intelligence(AI), IoT | • | • |
Lattice Semiconductor | CrossLink-NX | Image Sensor | • | |
Maxim | MAX32650 | Industrial, Portable Medical, IoT | • | • |
Microchip | PolarFire | Industrial, Communications, Defence | • | • |
NXP
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MAC57D5xxx | Automotive Cluster | • | |
S32K148 | Automotive Generic / Body | • | ||
S32V23x | Automotive ADAS | • | ||
Kinetis K80 | Industrial | • | ||
Kinetis K82 | Industrial | • | ||
Kinetis K27F / K28F | Industrial | • | ||
i.MX8 Family | Automotive Infotainment, Industrial, Consumer | • | • | |
i.MX 8ULP | Industrial, Smart Home, HMI |
• | • | |
i.MX RT1050 |
Industrial |
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i.MX RT1020 |
Industrial |
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i.MX RT1060 |
Industrial |
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i.MX RT1064 |
Industrial |
• |
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MCU-Based Solution for Alexa Voice Service |
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Industrial, Consumer |
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Industrial, Medical |
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Automotive Networking, Industrial |
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I.MX RT family |
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Automotive Radar |
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Consumer, Wearable, IoT |
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Renesas
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Automotive Cluster |
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Automotive Infotainment / ADAS |
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Automotive Digital Cockpit, infotainment |
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Automotive Infotainment / ADAS |
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Automotive Gateway, Domain Control |
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Automotive ADAS |
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Automotive ADAS |
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ADAS / Autonomous Driving |
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Automotive ADAS and A.D. |
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Industrial, A.I. |
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Semidrive |
Automotive Cluster and Body |
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ST
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STM32L4Rx |
Industrial |
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Automotive Gateway |
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SPC58EHx / SPC58NHx |
Automotive Body, Network, Security |
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Industrial |
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Industrial |
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Texas Instruments |
Industrial |
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Industrial, Networking |
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Automotive Digital Cockpit |
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ADAS |
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Xilinx
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Communications |
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Communications |
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Communications |
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Communications / Industrial |
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Networking |
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Networking |
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Various |
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Industrial |
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Industrial |
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HYPERBUS™ 3rd Party Development Platform
Partner | 3rd Party Development Platform |
Application | HyperFlash | HyperRAM |
Trenz Electronics |
TE0725 with Xilinx Artix-7 | Industrial | • | • |
TE0748 with Xilinx Artix | Secure SD | • | • | |
Devboards | HyperMAX with Altera MAX10 | Industrial, Medical, Automotive |
HyperBus Memory Controller IP
IP Supplier |
Link |
Can be integrated in FPGA as Soft IP |
Can be integrated in a SoC |
Infineon |
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Cadence |
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Mobiveil |
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Synaptic Laboratories Ltd. |
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Synopsys |
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HyperBus Memory Controller Verification IP
IP Supplier | Link | HyperFlash | HyperRAM |
Cadence | Link for Cadence | • | • |
- Understand the evolution of the cockpit architecture
- Recognize the importance of the central modules like head unit and cockpit domain controllers and get to know Infineon solutions and their components
- Understand the need for an expansion memory and recognize the key attributes designers look for
- Describe the challenges with existing expansion memory options
- Understand the key features of RAM offerings, and be aware of the memory solutions applications in automotive
- Know the RAM product portfolio, understand the different types of memories, key applications and use cases
- Know what Industry 4.0 is and the main challenges of high tech challenges in realizing its vision
- Understand the key features of RAM offerings and be aware of memory solutions use cases for the industrial market