EconoPIM™ 2 & 3

综述

Our integrated PIM technology tailored for general purpose inverters

Each EconoPIM™ module integrates a rectifier bridge, a brake chopper and an inverter stage. The Econo housing features a copper base plate for optimized heat spread and includes a thermistor (NTC). The Econo modules are available with solderable pins or with PressFIT pins and an increasing number of Econo modules is available with pre-applied TIM already. 

EconoPIM™ integrates various chip technologies that allows to cover a wide range of application requirements, starting from NPT to Trenchstop in 650V/1200V/1700V. The latest addition to the EconoPIM™ family is the TRENCHSTOP™ IGBT7 chip generation, which is optimized for industrial drives applications. EconoPIM™ IGBT modules with IGBT7 can withstand 175°C Tvjop under overload condition.

Related information about other products in our Econo family

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亮点

The EconoPIM™ family was developed in order to have a cost-effective compact design as well as simplified and reliable mounting. With these modules, we offer an optimized product generation for low- and medium-power industrial drives.

Key Features Main Application
  • Integration: Rectifier bridge, brake chopper, inverter stage and NTC in just one package to enable system-cost-savings
  • Flexibility: Customizable package (pin position and topology can be adapted to customer needs)
  • One fits all: numerous voltages (600 V – 1700 V) and currents (15 A – 200 A) serve several applications for platform design strategies
  • Power density: EconoPIM™ 2 and 3 have the broadest portfolio and highest power density for IGBT7 with 100 A for EconoPIM™ 2 and 200 A for EconoPIM™ 3
  • Performance: Pre-applied TIM allows increased output power compared to standard module + longer lifetime
  • Standardization: Established RoHS-compliant housing concept for high availability
  • Simplicity: PressFIT for main as well as auxiliary terminals to reduce mounting effort

Overview EconoPIM™ 2 & 3

Overview portfolio for EconoPIM modules

The EconoPIM™ 2 and 3 module portfolio with TRENCHSTOP™ IGBT7 ranges from 25 A up to 200 A. Compared to the previous IGBT4 chip generation, there is a higher power density, an increased switching frequency and the cooling effort can be reduced.

All in all, there is the same or better lifetime while keeping the operating conditions unchanged.

PIM Topology

Diagram for PIM technology

The PIM (Power Integrated Module) topology is a product, that integrates a three-phase inverter, a rectifier bridge, and a break chopper circuit into one single module. The high level of integration results in a compact design.

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A thermal interface material, especially developed for and pre-applied to Infineon`s power modules outperforms the general purpose materials available.

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