OptiMOS™ and StrongIRFET™ Latest Packages

综述

新一代能节省空间，高性能的封装

OptiMOS™ and StrongIRFET™ Latest Packages 子类别

OptiMOS™技术首次实现了大电流应用所需的极低的RDS_(on)值，它采用了节省空间的封装，如SuperSO8、S3O8和CanPAK™ 和TO-Leadless封装，这在以前只能采用笨重的大封装。利用OptiMOS™ 5功率块MOSFET，客户可以实现基准效率和大电流处理能力。

用OptiMOS™ 5功率块取代两个独立的分立封装，客户可以将其设计尺寸减少至少50%。TOLL封装的OptiMOS™ MOSFET是小型封装实现高功率应用的理想解决方案。在一个5x6 mm²的无引脚SMD封装中实现双管功率级，完美地将同步DC-DC转换器的低边和高边MOSFET组合在一起，极大地节省了空间。

利用DirectFET™封装的MOSFET，轻松实现双面散热，并提升效率利用SuperSO8封装的OptiMOS™功率MOSFET，极大地改善了温升。

Latest webinar videos

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Webinar Presentation - How to choose the right MOSFET for you application - Key parameters and application use casesShare
01_00 | Apr 08, 2022 | PDF | 4.89 mb

Webinar - The right MOSFET package for your application

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网络研讨会问答功率 MOSFET 封装 – 选择适合您应用的适当产品Share
01_00 | Jan 21, 2022 | PDF | 368 kb

Watch latest eLearning

Why throughhole packages are still needed

Wondering why designers still choose through-hole packages for their designs? This interactive training will answer that and take a high level look at the different through-hole MOSFET packages currently on the market, using Infineon products as examples.

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TOLG: the innovative package TO-Leaded with gullwing

This training explains the benefits of using the TOLG and the target industrial and automotive applications of this package. It also lists the current available portfolio and explains what you will gain by using the package

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