Flash+RAM MCP Solutions

Cellular handset designers and other leading manufacturers face many challenges providing the latest features in decreasing footprints. Infineon MCP devices meet these challenges by offering a single, space-saving package with the performance and quality that customers expect from Infineon products.

Because the various Infineon MCP solutions are stacked in a consistent footprint and pinout, you can easily design a single-board using a universal MCP footprint and provide differentiated products without redesigning your board. In addition, the advanced stacking technology utilized can readily be applied to new Flash, SDRAM or other devices as they are introduced.

As a high volume consumer of SRAMs and pSRAMs for integration into MCPs, Infineon can secure supply at reduced prices and pass on those savings to you. In addition, we manage the complex logistics, quality and inventory management issues that can arise when procuring memory, thereby enabling you to streamline your supply chain.

Last Updated: May 06, 2022

Infineon works directly with our partners to ensure our HYPERBUS™ memory solutions are fully compatible with existing and new chipsets. This effort ensures Infineon’s products can be easily paired with chipsets from industry-leading manufacturers while shortening customers’ embedded system design cycles.

Check back regularly to verify the growing list of microcontrollers supporting HYPERBUS™ products.

HYPERBUS™ Chipset Support

HYPERBUS™ 3rd Party Development Platform 

HyperBus Memory Controller IP

HyperBus Memory Controller Verification IP