1EDI3021AS
The EiceDRIVER™ 1EDI3021AS is an automotive qualified single channel high voltage gate driver optimized for IGBT technologies.
The EiceDRIVERTM 1EDI3021AS uses robust Infineon Coreless Transformer Technology to provide bi-directional signal transfer across the galvanic isolation barrier.
Comprehensive safety features and ISO26262 compliance enable ASIL D classification on system level. Accompanying safety documents ease and speed-up FMEDA analysis in the application.
The compact package design and high level of feature integration save valuable PCB space and system cost, while pre-configured settings reduce design efforts.
Pin-compatible product variants make it easy to switch between variants and swiftly adjust ECUs to different application needs (i.e. SiC MOSFET vs IGBT).
Zusammenfassung der Merkmale
- Single channel isolated IGBT driver
- For IGBTs up to 1200 V
- High CMTI up to 150 V/ns
- 8 kV basic insulation according to DIN VDE V 0884-11:2017-01
- 6.8kV reinforced insulation according to DIN VDE V0884-11:2017-01
- Basic and reinforced insulation according to UL 1577
- Min. 12 A peak current rail-to-rail output
- Propagation delay 60 ns typical
- Typ. 10 A integrated Active Miller Clamp supports unipolar switching
- ASC pin for PMSM motor drive application
- Integrated safety features to support ASIL B(D):
- DESAT and differential OCP protection
- Gate and output stage monitoring
- Shoot-through protection
- Primary/secondary supply monitoring
- Internal supervision - Advanced driver diagnosis with duty cycle coded DATA pin
- Green Product (RoHS compliant)
- AEC-Q100 qualified
- Compact DSO-20 fine pitch package
Vorteile
- Easy product use: pre-configured settings, no programming necessary
- Pin-compatibility makes it easy to switch between variants and swiftly adjust ECUs to different application needs (i.e. SiC MOSFET vs IGBT)
- Comprehensive safety features and ISO26262 compliance enable ASIL D classification on system level. Accompanying safety documents ease and speed-up FMEDA analysis in the application
- Reduced BoM and PCB space due to feature integration and compact package design
