HybridPACK™ DSC

Überblick

HybridPACK™ DSC is the perfect high power density solution for your compact, flexible, and integrated inverter design

What are the benefits of Infineon‘s HybridPACK™ DSC?

HybridPACK™ DSC
HybridPACK™ DSC
  • Superior power density on system level compared to single sided cooled modules: 40% improved thermal performance, Half the volumetric footprint on inverter level, and 5x gravimetric savings on inverter level
  • Proven track record with over 5 Mio electric vehicles sold relying on Infineon´s HybridPACKTM DSC and over 5 years of production experience
  • Available with two benchmark automotive chips: IGBT3 and EDT2. IGBT3 is used in older versions, ensuring high robustness and reliability. EDT2 is used in newer versions ensuring an additional 20% in efficiency under light-load conditions
  • Advanced on-chip temperature and current sensor allow for 50x faster measurement and enhanced protection due to point-of-interest measurements, thereby allowing for die protection and more efficient inverter design

HybridPACK™ DSC
Produkte
Highlights

  • Application notes, a new Evaluation Kit for DSC S1 and S2 using a reference cooler from BOYD Corporation is available on the Infineon Website
Trainings
HybridPACK™ Double-Sided Cooling S2 for compact and efficient inverter design

HybridPACK™ Double-Sided Cooling S2 for compact and efficient inverter design

Infineon introduces an update to the HybridPACK™ DSC, a product family of double-sided cooled power modules for main inverters in hybrid and full electric vehicles. In this training, you will learn more about the newest addition to the HybridPACK™ DSC family: HybridPACK™ DSC S2 with EDT2 chip technology.

Support