PQFN 8x6
Discover PQFN 8x6: the latest high performance, high current and high power-density package solution – TOLL performance in half the package size
New PQFN 8x6 is a high performance, high power density clip-based package optimized for currents up to 650 A. A footprint reduction of > 50% compared to TOLL, together with a height reduction of 50%, results in an overall space saving of >70% enabling compact designs.
The seamless backward compatibility of this package with PQFN 5x6 enables power scalability of the same board or less paralleling of MOSFETs.
Less MOSFET paralleling
PQFN 8x6 can easily replace two PQFN 5x6 products with similar performance. This enables reducing overall part count with a robust single-chip solution and reducing board space by 27%.
Performance advantage
PQFN 8x6 is a power-packed innovative package solution the fills the gap between PQFN 5x6 and TOLL. It can achieve high power levels similar to TOLL in a compact 48 mm2 footprint which is slightly larger than PQFN 5x6 (30 mm2). High power levels of 1-1.35 kW of continuous power can be achieved with PQFN 8x6.
- High current capability
- Compact 8.0x6.0 mm2 footprint
- Enables Industry-best RDS(on) and FOM
- Latest OptiMOS™ MOSFET technology
- Leadless package similar to PQFN 5x6
- Ultra-low package parasitics
- Footprint compatibility with PQFN 5x6
- Increased power density allows higher power designs in a compact board space
- Very low conduction losses, Low thermals and less device paralleling
- Low EMI
- Delivers benchmark performance with best-in-class power density and power efficiency
- Simpler PCB design with scalability across various power levels
