Infineon Presents the Smallest GNSS Module in the World: BGM1143N9 Enables Compact Mobile Phones with Reliable Navigation Functionality

Nuremberg, Germany – October 8, 2013 – Today, at the European Microwave Week tradeshow, Infineon Technologies introduced the latest generation of its pico GNSS (Global Navigation Satellite System) modules for smartphones. BGM1143N9 is a combination of a low-insertion-loss pre-filter and Infineon’ s high performance low noise amplifier (LNA) in a TSNP-9 package. It is the smallest module worldwide, features very high linearity, lowest noise figure and supports all navigation standards including GPS, GLONASS and BeiDou.

With a footprint of only 1.5 mm x 1.1 mm BGM1143N9 is the smallest GNSS module available in the market today. It requires 60 percent less board space compared to the previous generation. Size is particularly important for smartphones, since PCB space is a premium.

Today’s mobile phones offer a wide range of features. Therefore, transmitter and receiver have to work together simultaneously without degrading each other’s performance. A GNSS receiver co-exists with transceivers in the GSM/ EDGE/ UMTS/ LTE bands that transmit high power in the range of +24 dBm. Due to its very high linearity the LNA integrated in BGM1143N9 effectively prevents interference from higher order harmonics and intermodulation products of the strong signal present in smartphones, thus ensuring reliable navigation.

Furthermore, BGM1143N9 dramatically improves sensitivity compared to other solutions available in the market today. It features the lowest noise figure available in the market (1.45 dB) which increases the GNSS system’s sensitivity and improves time-to-first-fix (TTFF) and time-to-subsequent-fix (TTSF). This feature results in a much faster and continuous navigation and consequently much higher end user satisfaction.

The new BGM1143N9 supports all navigation standards: GPS, GLONASS, Galileo as well as China’s BeiDou Navigation Satellite System (BDS).

Availabilty

Samples and evaluation boards of BGM1143N9 are already available. Volume production will start in early 2014.

For more information please visit www.infineon.com/nav.frontend

Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, mobility, and security. In the 2012 fiscal year (ending September 30), the Company reported sales of Euro 3.9 billion with close to 26,700 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).