Accelerating and simplifying software development: Infineon launches Drive Core for AURIX™, TRAVEO™ and PSOC™

Munich, Germany – 7 March 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching Drive Core, a scalable software bundle portfolio for AURIX™, TRAVEO™ and PSOC™ that facilitates a rapid start into automotive software development. Drive Core bundles pre-integrated software and tools from Infineon and third-party providers ready-to-use under a three-month evaluation license.

“With the introduction of Drive Core, we are accelerating and simplifying our customers’ software development while reducing their commercial complexity in supplier management," said Patrick Will, Senior Director at Infineon. "Drive Core offers a seamless user experience throughout the R&D journey by pre-integrating our partners’ and our own software components and toolchains, thereby minimizing migration efforts with a single click.”

Infineon launches the first five software bundles for Embedded World 2025, spanning across AURIX, TRAVEO T2G and PSOC 4 HV. They are available under a three-month evaluation license:

AURIX Drive Core AI: TC4x PPU model-based development

The AURIX Drive Core AI bundle integrates third-party tools and software components, enabling developers to efficiently evaluate the TC4x Parallel Processing Unit (PPU) – a high-performance computing platform tailored to the requirements of e-mobility and autonomous driving. The solution ensures an easy and fast setup of the model-based design flow with MATLAB Simulink and the AURIX Hardware support package.

Besides the required compiler tools, compute and neural network libraries, the bundle also contains ready to use Simulink examples and a comprehensive tutorial.

Developed in collaboration with Infineon's ecosystem partners, including HighTec, MathWorks and Synopsys, the bundle offers powerful simulation and design capabilities with the PPU for automotive engineers.

AURIX Drive Core AUTOSAR: TC4x with Vector MICROSAR and Tasking compiler

The AURIX Drive Core AUTOSAR software bundle is designed to streamline AUTOSAR-based projects for different kinds of safety applications, such as ADAS or zone controllers. The embedded software components include Infineon’s MCAL driver and MICROSAR Classic, a pre-integrated real-time capable base software stack from Vector. Tasking provides their latest certified development toolchain for TC4x.

AURIX Drive Core for NeuSAR: TC4x with NeuSAR cCore from our development partner Neusoft Reach

The AURIX Drive Core NEUSAR bundle, which is targeting the Chinese automotive market, comes with all required tools and software to develop a full AUTOSAR classic solution with TC4x. It includes NeuSAR cCore 4.0, an AUTOSAR software platform according to R21-11, including a full-stack security solution and a bootloader – certified according to ISO 21434 ASIL-D. The software platform is pre-integrated with Infineon's AUTOSAR MCAL drivers and C/C++ compiler tools from HighTec. Developers can immediately start their work with different example projects. A comprehensive documentation in Chinese and English addresses local requirements.

TRAVEO T2G Drive Core Graphics: Graphics Driver and QT graphics stack

The TRAVEO T2G Drive Core Graphics bundle allows customer to evaluate the TRAVEO T2G for cockpit applications. It provides a hardware abstraction layer and graphics drivers from Infineon, an IAR compiler and is enhanced through advanced graphics capabilities and AUTOSAR readiness of Qt for MCUs graphics stack. Furthermore, the bundle includes the TRAVEO T2G, Infineon’s MCAL and QT’s graphics.

PSOC 4 HV Drive Core Control: APDL with Vector OS

Infineon introduces a bundle with Vector's product MICROSAR IO, used as the basic software. MICROSAR IO is a lightweight, secured and efficient base layer for small mechatronic electronic control units in automotive applications. Designed for automotive subsystems such as battery management, parking sensors and HVAC systems, MICROSAR IO emphasizes cost efficiency, reusability and OEM independence. In combination with Infineon's PSOC 4 HV microcontroller, the bundle provides a resource-efficient solution, reduces the overall system cost and ensures reliable functionality in mission-critical domains.

Availability

The described first software bundles will be presented at embedded world 25 in Nuremberg from March 11 to 13. Further information is available at www.infineon.com/drivecore.

Infineon at Embedded World

Embedded World will take place in Nuremberg, Germany from 11 to 13 March, 2025. Infineon will present its products and solutions for decarbonization and digitalization in hall 4A, booth #138 and virtually . For press inquiries please contact media.relations@infineon.com . Industry analysts interested in a briefing can email   MarketResearch.Relations@infineon.com. Information about the Embedded World show highlights is available at  www.infineon.com/embedded-world.

About Infineon

Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The Company had around 58,060 employees worldwide (end of September 2024) and generated revenue of about €15 billion in the 2024 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).

Further information is available at www.infineon.com

This press release is available online at www.infineon.com/press

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