High-performance cockpit controller
Broad product portfolio and advanced technologies enable next-generation automotive cockpit system designs
Unleash high computer processing power and an enhanced user experience with a cockpit domain controller (CDC) that supports different operating systems (OS) through a scalable hardware platform. Typically enabled by high-performance system-on-chip (SoC), microcontroller, memory, Wi-Fi & Bluetooth®, power supply, and sensor components, Infineon's rigorously tested product portfolio is designed to meet the demands of complex fundamental functions.
Our cockpit solutions cover key head unit functions with scalability
Our central car computer solutions provide a comprehensive product portfolio to meet your requirements.
Computing: The TRAVEO™ T2G-B MCU family offers high performance (up to dual Arm® Cortex®-M7, 1500 DMIPs), wide scalability (memory density and package line-up), best-in-class energy efficiency (deep sleep mode: 35 µA, hibernate mode: 5 µA), ASIL-B functional safety and an integrated hardware security module (HSM).
Sensors: The PSoC™ automotive family offers in-cabin touch solutions from a single source. Automotive-qualified MEMS microphone sensors provide supreme audio reception in dynamic environments.
Connectivity and communication: Broad Wi-Fi and Bluetooth® portfolio supports various in-cabin wireless connections. CAN, LIN transceivers, and system basis chip (SBC) families connect the head unit to in-vehicle networking.
Power supply: OPTIREG™ PMIC, linear, and switcher devices support reliable power supply; USB-C PD controllers support fast charging (up to 100 W) with best-in-class interoperability and compliance with all kinds of mobile devices.
Storage: Broad automotive-qualified NOR flash, SRAM, and F-RAM portfolio provides safe, secure, and reliable data storage.
Reduce R&D effort with our cockpit domain controller solutions
Check out the benefits of Infineon's cockpit domain controller system solutions below.
Scalability:
Scalable family solutions with wide compatibilities on both hardware and software support designs from low- to high-end systems with less design effort.
Performance:
Best-in-class performance of sensing solutions (touchscreens, microphones, etc.), wireless solutions (Wi-Fi and Bluetooth®), and fast-charging solutions (USB-C PD) improves customer experience significantly.
Security:
Secured MCU, secured memory, and secured connectivity support secured firmware updates over-the-air (FOTA) and safeguard consumers from cyber-attacks.
Total cost of ownership:
Broad portfolio provides a one-stop shop on both commercial and technical which significantly reduces purchase cost as well as system design effort.
AIROC™ Wi-Fi and Bluetooth® solutions for robust connectivity
Infineon is leading in real simultaneous dual band (RSDB) solutions providing simultaneous operation in both 2.4 GHz and 5 GHz bands, as well as multiple-input multiple-output (MIMO) support. RSDB solutions provide the necessary bandwidth and the software architecture required to support complex use-case scenarios for cars, enabling combinations of AP, station, and P2P connections simultaneously.
Learn more about AIROC™ Wi-Fi & Bluetooth® combos.
Superior human-machine interface with PSoC™ automotive multitouch
With the world's broadest portfolio of touchscreen solutions, our patents cover categories from panel construction and self- and mutual-capacitance sensing to scanning methods, noise immunity, and finger tracking, spanning every major area of touch sensing innovation. Our continued leadership in the touchscreen space means that we respond to new challenges and market trends with truly innovative solutions.
Learn more about automotive touchscreen solutions.
Recommended memories for automotive infotainment systems
Infineon parallel NOR flash devices and serial NOR flash devices feature automotive-proven MIRRORBIT™ technology to ensure data reliability and the high endurance required for frequent writes over the product lifespan. In addition, they provide fast system boot times and different densities to scale platforms. Infineon’s NOR flash solutions are AEC-Q100 grades 1 to 3 qualified to meet automotive standards for a wide operating temperature range.
Infineon's automotive F-RAM has no write delays and data is immediately non-volatile. F-RAM offers a virtually unlimited endurance of 100 trillion read/write cycles. This enables much more compact and robust designs compared to conventional EEPROM solutions.
Infineon’s HYPERRAM™ 2.0 is a high-speed, low-pin-count, self-refresh dynamic RAM (DRAM) for high-performance embedded systems requiring expansion memory. HYPERRAM™ 2.0 offers HYPERBUS™ and Octal SPI interfaces that draw upon the legacy features of both parallel and serial interface memories while enhancing system performance and ease of design, as well as reducing system cost.
Excellent acoustics via XENSIV™ microphone and MERUS™ audio amplifier
Automotive XENSIV™ MEMS microphones are suited to all applications inside and outside the car, where the best audio performance in harsh automotive environments is required. These automotive microphones enable distortion-free audio capture for all speech-related applications, improving speech intelligibility for voice recognition algorithms. In addition, our sensors perfectly support microphones for ANC (acoustic noise cancellation) with flat frequency and stable phase response. XENSIV™ MEMS microphones are qualified according to the state-of-the-art automotive quality standard AEC-Q103-003.
With an increasing number of audio channels per product, traditional class D amplifiers face design challenges in compact designs: Low power efficiency, excessive heat generation (even at moderate sound levels), and the need for bulky, costly filters. Infineon’s MERUS™ multilevel class D audio amplifier circuit technology – the world’s first of its kind – has made it possible to improve power consumption while reducing electromagnetic interference and out-of-band noise. Manufacturing costs can also be reduced by eliminating or minimizing the use of filters, helping to save design space.
Learn more about XENSIV™ silicon microphones.
Learn more about MERUS™ class D audio amplifiers.
- Understand Infineon’s pioneer role driving the automotive MEMS microphone market and its needs
- Discover the main features and key benefits of Infineon’s XENSIV™ microphone and identify the target automotive applications for this product
This training is a product selection guide to help you find the most suitable MEMS microphones for your applications.
Description:
- Understand the evolution of the cockpit architecture
- Recognize the importance of the central modules like head unit and cockpit domain controllers and get to know Infineon solutions and their components
- Identify the main automotive market drivers and how OPTIREG™ aims to address these and
- Recognize OPTIREG™’s product families and groups, as well as their main features and target applications
Identify the three pillars upon which Infineon quality is based and recognize the main focus points of Infineon’s transceiver quality program
- Define MCU companions, list the challenges they address, and describe some use cases
- Know about Infineon’s automotive MCUs
- Infineon has a successful history of supporting various graphics applications in cars with displays.
- Infineon's TRAVEO™ T2G microcontrollers are designed to meet size constraints, reduce costs, and improve performance and bandwidth for car displays, compared to system-on-chip solutions.
