pmd and Infineon: unbeatable symbiosis enabling world-class ToF sensor solutions

“pmd and Infineon joined forces to deliver the most advanced 3D ToF Image Sensor solutions available. pmd depth sensing experts in combination with world-class design- and manufacturing power from Infineon are an unbeatable combination to serve and fulfill  the needs of our customers”

Christian Herzum (Vice President 3D-Sensing · ‎Infineon Technologies AG) 

The ToF image sensor solution bundles pmdtechnologies’ patented ToF technology and end-to-end system-level hardware and software know-how with Infineon’s landmark REAL3™ 3D image sensor based on advanced CMOS technology. The high-performance, cost-effective imager uses best-in-class ToF imaging technology. In addition, it accelerates and simplifies the design-in process by including the software driver and 3D depth processing pipeline, complemented by a reference design, customization support and camera module maker enablement. Both companies are committed to working closely with customers to optimize implementation and anticipate evolving needs in the emerging augmented reality, spatial awareness, photo enhancement and secure facial ID applications.

Here you will find further information on how REAL3™ 3D image sensors work.

• Founded in 2002
• Headquarters in Siegen, Germany
• Offices in Dresden and Ulm, Germany;
• Subsidiaries in: San Jose, USA; Seoul, Korea; Shanghai, China;
• 400 patents related to Time-of-Flight technology
• 150 employees
• Serving the consumer, automotive and industrial market
• Official Google Project Tango Partner, that brought the first ever
  smartphone with ToF sensor to market
• Winner of renowned German Hermes Award and other technology awards
• Time-of-Flight technology is already integrated into millions of devices worldwide

Fully integrated offering for entire 3D Time-of-Flight (pixel) design and production ecosystem. Enabling differentiated, optimized designs that meet power, size and cost targets in combination with sophisticated depth and AI algorithms, detection and correction of depth data artifacts, depth software support plus most advanced, fastest and volume-proven calibration and test setups for fast time-to-market.

• Opportunity for customers to add value through differentiation
  pmdtechnologies’ engineers put their bundled, cutting-edge ToF system layout expertise to work for customers, enabling differentiated, optimized designs that meet power, size and cost targets
• Extensive integration and customization support
  Holistic offering spanning sophisticated depth and AI algorithms, detection and correction of depth data artifacts, depth software support plus most advanced, fastest and volume-proven calibration and test setups
• Robust performance under all conditions
  pmdtechnologies’ cutting-edge software, AI and hardware know-how enables ToF systems that work reliably in tough environments characterized by strong ambient light, harsh conditions and challenging objects
• Miniaturized designs
  Single-chip solution enables incredibly small and robust camera modules with minimum design effort
• Reduced BoM and costs
  Highly integrated offering (laser safety, power supply, low-cost VCSEL driver) reduces the BoM for camera modules and brings differentiating features to high-volume phone segments
• Fast time-to-market
  Mutually complementary, fully integrated offering from Infineon and pmdtechnologies spanning the entire design and production ecosystem