Flash+RAM MCP solutions
Flash and RAM in a single package for ease of design
For systems that require flash and RAM memory, Infineon multi-chip package (MCP) solutions simplify overall system design. By integrating both memories into a single package, Infineon MCP products decrease the BOM, lower the pin count, and reduce the PCB size and layer requirements. Infineon MCP solutions offer a single, space-saving package with no compromise in performance and quality.
- Flash and RAM in a single package
- Standard pinouts
- Common footprints
- xSPI-compliant interfaces
- BENEFITS:
- Smaller, simpler PCB
- Lower pin count
- Fewer PCB layers
- Easy migration
- Fast time to market
Next-generation portfolio of multi-chip package (MCP) memory products
Flash+RAM MCP Gen 2 improves on HYPERBUS™ MCP (the prior generation) with increased performance and reliability. MCP Gen 2 upgrades from HYPERFLASH™ to SEMPER™ NOR flash and from HYPERRAM™ 1.0 to HYPERRAM™ 2.0. MCP Gen 2 also expands chipset support with the addition of an octal interface option.
Enhance new and existing designs with compatible memory packages
Compared to separate flash and RAM chips, Infineon MCPs simplify PCB complexity in two ways:
- Combining two chips in one reduces the BOM.
- Going from a wide, parallel DDR SDRAM interface to a shared serial interface reduces the number of traces.
The result is a smaller PCB with fewer layers. Infineon also enables backward and forward compatibility with common packages. SEMPER™ NOR flash, HYPERFLASH™, HYPERRAM™, and MCP solutions all share a consistent footprint and pinout. This common design enables a single board to support a variety of memories without major redesign and provides the flexibility to easily expand from flash or RAM to a system that supports both.
Standard JEDEC xSPI interfaces (Octal and HYPERBUS™)
The JEDEC xSPI standard (JESD251) was adopted in 2017 to promote compatibility and interoperability between memory, chipsets, and other devices. Infineon’s Flash+RAM MCP Gen 2 is offered in Octal (JEDEC xSPI Profile 1) and HYPERBUS™ (JEDEC xSPI Profile 2) interface options. Both offer the maximum x8 performance of 400 MBps as specified by the standard.
Solutions Hub (SDKs, kits and boards, IDEs, OS support)
SEMPER™ Solutions Hub provides all the necessary building blocks to successfully integrate SEMPER™ NOR flash into your design, including:
- Software development kits
- Hardware development platforms
- Support for a variety of development environments
- Linux/U-Boot support
Visit the hub now to gain time-to-market advantage.
Product | Flash+RAM MCP Gen 2 | HYPERBUS™ MCP | |
Flash | SEMPER™ NOR Flash | HYPERFLASH™ | |
RAM | HYPERRAM™ 2.0 | HYPERRAM™ 1.0 | |
Series | S78 | S76 | S71 |
Interface | Octal (xSPI Profile 1) |
HYPERBUS™ (xSPI Profile 2) |
HYPERBUS™ |
Family | HS-T (1.8V) HL-T (3.0V) |
KS-S (1.8V) KL-S (3.0V) |
Last Updated: May 06, 2022
Infineon works directly with our partners to ensure our HYPERBUS™ memory solutions are fully compatible with existing and new chipsets. This effort ensures Infineon’s products can be easily paired with chipsets from industry-leading manufacturers while shortening customers’ embedded system design cycles.
Check back regularly to verify the growing list of microcontrollers supporting HYPERBUS™ products.
HYPERBUS™ Chipset Support
Partner | Chipset / Platform Name | Application | HyperFlash | HyperRAM |
Infineon |
TRAVEO™ S6J331x | Automotive Cluster | • | • |
TRAVEO™ S6J335x | Automotive Gateway | • | • | |
TRAVEO™ S6J326Cx | Automotive Cluster | • | • | |
TRAVEO™ S6J324Cx | Automotive Cluster | • | • | |
TRAVEO™ S6J327Cx | Automotive Cluster | • | • | |
TRAVEO™ S6J328Cx | Automotive Cluster | • | • | |
TRAVEO™ S6J32DAx | Automotive Cluster | • | • | |
TRAVEO™ S6J32BAx | Automotive Cluster | • | • | |
TRAVEO™ II CYT4BF | Automotive Body | • | • | |
TRAVEO™ II CYT3BB/4BB | Automotive Body | • | • | |
FM4 Family S6E2DH Series | Industrial | • | • | |
Altera/Intel |
MAX10 | Industrial | • | • |
Cyclone 10 LP | Industrial | • | • | |
Faraday Tech |
A600 | IoT | • | • |
GCT | GDM7243i | IoT | • | • |
Gowin Semiconductor | GW1NSR-2C | FPGA, Industrial | • | • |
Greewaves Technologies | GAP8 | Artificial Intelligence(AI), IoT | • | • |
Lattice Semiconductor | CrossLink-NX | Image Sensor | • | |
Maxim | MAX32650 | Industrial, Portable Medical, IoT | • | • |
Microchip | PolarFire | Industrial, Communications, Defence | • | • |
NXP
|
MAC57D5xxx | Automotive Cluster | • | |
S32K148 | Automotive Generic / Body | • | ||
S32V23x | Automotive ADAS | • | ||
Kinetis K80 | Industrial | • | ||
Kinetis K82 | Industrial | • | ||
Kinetis K27F / K28F | Industrial | • | ||
i.MX8 Family | Automotive Infotainment, Industrial, Consumer | • | • | |
i.MX 8ULP | Industrial, Smart Home, HMI |
• | • | |
i.MX RT1050 |
Industrial |
• |
• |
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i.MX RT1020 |
Industrial |
• |
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i.MX RT1060 |
Industrial |
• |
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i.MX RT1064 |
Industrial |
• |
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MCU-Based Solution for Alexa Voice Service |
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Industrial, Consumer |
• |
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Industrial, Medical |
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Automotive Networking, Industrial |
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I.MX RT family |
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Automotive Radar |
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Consumer, Wearable, IoT |
• |
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Renesas
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Automotive Cluster |
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Automotive Infotainment / ADAS |
• |
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Automotive Digital Cockpit, infotainment |
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Automotive Infotainment / ADAS |
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Automotive Gateway, Domain Control |
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Automotive ADAS |
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Automotive ADAS |
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ADAS / Autonomous Driving |
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Automotive ADAS and A.D. |
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Industrial, A.I. |
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Semidrive |
Automotive Cluster and Body |
• |
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ST
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STM32L4Rx |
Industrial |
• |
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Automotive Gateway |
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SPC58EHx / SPC58NHx |
Automotive Body, Network, Security |
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Industrial |
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Industrial |
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Texas Instruments |
Industrial |
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Industrial, Networking |
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Automotive Digital Cockpit |
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ADAS |
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Xilinx
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Communications |
• |
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Communications |
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Communications |
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Communications / Industrial |
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Networking |
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Networking |
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Various |
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Industrial |
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Industrial |
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HYPERBUS™ 3rd Party Development Platform
Partner | 3rd Party Development Platform |
Application | HyperFlash | HyperRAM |
Trenz Electronics |
TE0725 with Xilinx Artix-7 | Industrial | • | • |
TE0748 with Xilinx Artix | Secure SD | • | • | |
Devboards | HyperMAX with Altera MAX10 | Industrial, Medical, Automotive |
HyperBus Memory Controller IP
IP Supplier |
Link |
Can be integrated in FPGA as Soft IP |
Can be integrated in a SoC |
Infineon |
• |
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Cadence |
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Mobiveil |
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Synaptic Laboratories Ltd. |
• |
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Synopsys |
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HyperBus Memory Controller Verification IP
IP Supplier | Link | HyperFlash | HyperRAM |
Cadence | Link for Cadence | • | • |