Infineon® Prime Block
Designed for highest performance
For highest performance or when the desired current exceeds 330 A for 50 mm we have designed the Prime Line 50 modules with best-in-class power density reaching 370 A in the standard 50 mm housing. These modules have been optimized regarding thermal resistance and qualified for higher junction temperatures to push their performance beyond current limits.
The result is highest power density in same foot print and our well-known reliability, leading to outstanding lifetime. Our pressure contact modules in general provide best-in-class blocking stability and are H2S robust.
The 50 mm modules in pressure contact technology complete our Prime Line with 50 mm solder bond modules in 390 A. Benefit from highest current rating in a 50 mm footprint and predictably high performance due to 100% x-ray end-of-line monitoring of solder process.
| Key features 50 mm modules - solder contact | Key features 50 mm modules - pressure contact | Key features 60 mm modules - pressure contact |
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