HybridPACK™ 1 & DC6(i)
Infineon's HybridPACK™ 1 and DC6(i) is an established automotive-qualified power module optimized for size and cost for medium range performance
Infineon’s HybridPACK™ 1 is a proven and established automotive-qualified power module for xEV applications covering low and medium power classes from approximately 60 kW to 120 kW. Designed for a 150°C junction operation temperature, the module accommodates a 3-phase six-pack configuration of Trench-Field-Stop IGBT3 and matching emitter controlled diodes.
- Enables compact and light inverters
- Benchmark efficiency and ruggedness
- Supports easy assembly process
- Cost-effective devices
Infineon's HybridPACK™ 1 and DC6(i)
The HybridPACK™ 1 power module is based on Infineon’s IGBT Trench-Field-Stop technology and is suitable for air or liquid cooling. For a compact design, the driver stage PCB can easily be soldered on top of the module. All power connections are realized with screw terminals.
This design gained acceptance in the market and led to pave the way for further frame modules. Infineon followed up by introducing HybridPACK™ DC6. Two baseplate variants (flat and wave) enable direct water cooling. Therefore, better thermal performance can be achieved while different baseplates within the same footprint keep the performance scalable. Six instead of two power tabs on the DC side lower the stray inductivity and allow to extract more current from the power module. By that, the module is able to achieve higher power ranges from approximately 60 kW to 120 kW.
Key target applications for the HybridPACK™ 1 and DC6 family are inverters for hybrid and small battery electric cars and generators.
Benefits of Infineon's HybridPACK™ 1 and DC6(i)
- Benchmark automotive IGBT technology
- Size and cost-optimized solution for medium range performance, up to 120 kW
- Easy upgrade from a DC6 or HybridPACK™ 1 design (same mechanical footprint, different signal pinning in case of DC6(i))
- Maximum possible power respecting lifetime and reliability criteria
Key highlights of HybridPACK™ DC6 product family
- Variety of performances due to different cooling interfaces
- Mechanical guiding elements and pressFIT pins for the signal terminals
- 750 V EDT2 IGBT for up to Tvj = 175°C switching operation
- Benchmark IGBT chip with higher density and lower switching losses
