HybridPACK™ DSC
HybridPACK™ DSC is the perfect high power density solution for your compact, flexible, and integrated inverter design
The HybridPACK™ DSC from Infineon offers best-in-class thermal performance and power density, thanks to its innovative double-sided cooling (DSC) approach. This product family is specifically designed for electric vehicle traction inverters, providing a scalable power range within the 750 V and 1200 V classes.
- Double-sided cooling
- Compact design
- Low switching losses
- Available with Si IGBT and CoolSiC™
- Blocking voltage 750 V and 1200 V
Infineon's HybridPACK™ DSC
Our emphasis on innovation is not only recognizable in the variety of frame-based power modules but also in the HybridPACK™ DSC. Thanks to its double-sided cooling technology and half-bridge configuration, this power module is the ideal solution for compact, flexible, and integrated Si-based main inverter designs up to 75 kW. Two copper plates on both sides of the module are used for double-sided cooling (DSC) and herewith enable high power density. On-chip temperature and current sensors (overcurrent protection) offer a good compromise between security and performance. HybridPACK™ DSC modules offer scalability to support customers’ platform approach.
Next generation DSC with CoolSiC™ G2 technology
Infineon recognizes the complementary strengths of Si IGBT and SiC MOSFET technologies. In line with this belief, Infineon has launched the next generation of HybridPACK™ DSC featuring the advanced CoolSiC™ chipset. This new module delivers up to double the performance of previous Si-based DSC-S solutions, offering significant improvements under comparable conditions.
HybridPACK™ DSC CoolSiC™ power modules offer a compact and flexible traction inverter solution, leveraging Infineon's advanced CoolSiC™ G2 technology
With a track record of more than 10 million units sold since 2017, the HybridPACK™ DSC is one of Infineon’s market-leading power module family for electric vehicles.

Benefits of HybridPACK™ DSC
- High-power density package enabling very compact inverters
- CoolSiC™ G2, IGBT3 and EDT2 chip offers benchmark efficiency for electric vehicle inverters
- Advanced on-chip-temperature and current sensor
- Offers advanced reliability and robustness
- Proven package with over 10 Mio DSC modules already in use in various hybrid and plug-in hybrid vehicles as of today
HybridKIT™ for HybridPACK™ DSC S2 - automotive power module
Evaluation kit for HybridPACKTM DSC S2 automotive power module (FF450R08A03P2)
What are the key highlights of Infineon's HybridPACK™ DSC?
- Enhanced thermal performance by DSC
- Flexible and compact package
- Compact high voltage package by transfer mold
- Advanced protection by on-chip current and temperature sensor
- High temperature operational
- Application notes, a new Evaluation Kit for DSC S1 and S2 using a reference cooler from BOYD Corporation is available on the Infineon Website