HybridPACK™ DSC
HybridPACK™ DSC is the perfect high power density solution for your compact, flexible, and integrated inverter design
Infineon believes in Si IGBT and SiC MOSFET technology complementing each other and therefore will launch the next generation of HybridPACK™ DSC in 2024 with a CoolSiC™ chipset. This module will deliver up to double the performance compared to Si-based DSC-S solutions under similar circumstances.
- Double-sided cooling
- Compact design
- Low switching losses
- Available with Si IGBT and CoolSiC™
- Blocking voltage 750 V and 1200 V
Infineon's HybridPACK™ DSC
Our emphasis on innovation is not only recognizable in the variety of frame-based power modules but also in the HybridPACK™ DSC. Thanks to its double-sided cooling technology and half-bridge configuration, this power module is the ideal solution for compact, flexible, and integrated Si-based main inverter designs up to 75 kW. Two copper plates on both sides of the module are used for double-sided cooling (DSC) and herewith enable high power density. On-chip temperature and current sensors (overcurrent protection) offer a good compromise between security and performance. HybridPACK™ DSC modules offer scalability to support customers’ platform approach.
Benefits of HybridPACK™ DSC
- Very high power density package enabling very compact inverters
- IGBT3 and EDT2 chip offers benchmark efficiency for electric vehicle inverters
- Advanced on-chip-temperature and current sensor
- Offers advanced reliability and robustness
- Proven package with over 9 Mio DSC modules already in use in various hybrid and plug-in hybrid vehicles as of today
HybridKIT™ for HybridPACK™ DSC S2 - automotive power module
Evaluation kit for HybridPACKTM DSC S2 automotive power module (FF450R08A03P2)
What are the key highlights of Infineon's HybridPACK™ DSC?
- Enhanced thermal performance by DSC
- Flexible and compact package
- Compact high voltage package by transfer mold
- Advanced protection by on-chip current and temperature sensor
- High temperature operational
- Application notes, a new Evaluation Kit for DSC S1 and S2 using a reference cooler from BOYD Corporation is available on the Infineon Website
