800 V CoolMOS™ P7
A benchmark in efficiency and thermal performance
With the 800 V CoolMOS™ P7 series, Infineon sets a benchmark in 800 V superjunction technologies and combines best-in-class performance with state-of-the-art ease-of-use. This new product family is a perfect fit for flyback based consumer SMPS applications. In addition, it is also suitable for PFC stages within consumer, as well as solar applications, adapter, audio, lighting, AUX SMPS, industrial SMPS, fully covering the market needs in terms of its price/performance ratio.
This product family offers up to 0.6 percent efficiency gain and 2°C to 8°C lower MOSFET temperature compared to its predecessor as well as to competitor parts tested in typical flyback applications. It also enables higher power density designs through lower switching losses and better DPAK RDS(on) products. Overall, it helps customers save bill of material cost and reduce assembly effort. The integrated Zener Diode ESD protection significantly improves ESD robustness, thus reducing ESD related yield loss.
This product family continues to deliver well recognized best-in-class CoolMOS™ quality. In addition, CoolMOS™ P7 offers a new best-in-class RDS(on): in DPAK a RDS(on) of 280 mΩ is available, more than 50 percent lower than the nearest 800 V MOSFET competitor. This new benchmark enables higher power density designs, BOM savings, as well as lower assembly cost.
The technology offers fully optimized key parameters to deliver best-in-class efficiency as well as thermal performance. As demonstrated at a 80 W LED driver, bought on the market, the >45 percent reduction in Eoss and Coss as well as the significant improvement in Ciss and QG, compared to competitor technologies, lead to 0.5 percent higher efficiency at light load which helps to reduce standby power at the end application. At full load the observed improvement is up to 0.3 percent higher efficiency and 6°C lower device temperature.
EMI is a system level topic, and the optimization needs to be done on system level only. Nevertheless, a pure plug and play measurement at an Infineon 45 W adapter reveals that 800 V CoolMOS™ P7 shows similar EMI performance compared to Infineon’s previous technologies but also when compared to competitors’ technologies.
Compared to competition, the 800 V CoolMOS™ P7 technology allows to integrate much lower RDS(on) values into small packages, such as a DPAK. This finally enables high power density designs at highly competitive price levels.
Customer benefits:
- High power density
- Lower BOM cost
- Less production cost
The complete P7 platform has been developed with an integrated zener diode that is used as an ESD protection mechanism, which increases the overall device ruggedness up to HBM class 2 level.
The Thin-PAK 5x6 package is a leadless SMD package especially designed for high voltage MOSFETs. This package has a very small footprint of 5x6 mm² and a very low profile with 1 mm height.
The significantly smaller package size in combination with its benchmark low parasitics inductances can be used as an effective way to decrease system solution size in power- density driven designs.
Combining performance and ease of use with a cost-effective package solution
Designed for competitiveness in the low power SMPS market
Target applications, features and benefits
Overview about best-in-class performance, state of the art ease-of use and price/performance positioning
