DirectFET™

Overview

Leverage your performance

DirectFET™ has a uniquely simple construction that provides breakthroughs in die free package resistance, parasitic package inductance and heat dissipation capabilities. Compared to standard discrete packages DirectFET™ metal "can" construction enables double-sided cooling to effectively increase the efficiency and curent carrying capability of the device in a given footprint. DirectFET™ is compatible with today's high volume manufacturing processes.

Together with the latest MOSFET silicon technology, DirectFET™ products are the right choice for a wide range of applications where thermal behavior, energy efficiency and power density are in focus such as solar micro inverter, synchronous rectification, VRM modules for server, DC-DC converter, Or-ing switch and circuit breaker, desktop PC, workstations and mainframes. 

DirectFET™ packages

Key features Key benefits Applications
  • Exeptional power density
  • Low parasitic inductance
  • Double-side cooling
  • Low profile design
  • High current capability
  • High efficiency
  • Minimized EMI
  • Optimized thermals
  • Board space reduction
  • Less device paralleling
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