SuperSO8 DSC – PQFN 5x6 with dual-side cooling

Overview

OptiMOS™ power MOSFETs 40 V - 150 V in SuperSO8 DSC package with dual-side cooling for enhanced thermal performance

OptiMOS™ 6 40 V and OptiMOS™ 5 40 V-150 V power MOSFETs in SuperSO8 DSC (dual-side cooling) package offer all thermal management benefits of dual-side cooling solutions with industry-standard footprint.

When using bottom-side cooling solutions (e.g. SuperSO8, PQFN 5x6) most of the heat generated by the MOSFETs are transferred to the PCB, increasing the PCB temperature due to its poor thermal resistance. Dual-side cooling solutions add another thermal path (bottom through PCB + top through exposed clip and heatsink) to dissipate the heat generated in the MOSFET die.

About 30 percent of the heat generated on the MOSFET die is transferred through the top and less heat is transferred to the PCB. Thus,

either the PCB runs cooler at the same power dissipation for improved reliability,
or more power can be handled by the MOSFET for higher power density

The OptiMOS™ power MOSFETs in SuperSO8 DSC package are a perfect fit to a wide range of applications such as power and gardening tools, service robots and automated guided vehicles (AGVs), telecom power supplies, and server power supplies.

SuperSO8 DSC package (WSON-8)

Key features, benefits and applications

Key features	Key benefits	Applications
High performance silicon technology. Low top-side R_thJC (0.72 K/W for best-in-class products) Package rated to T_Jmax=175ºC Industry-standard footprint, compatible with SuperSO8 and PQFN 5x6 products	Lower conduction and switching losses for higher system efficiency. Superior power handling capability. Higher power density designs. Improved reliability and longer lifetime. Drop-in replacement for SuperSO8 and PQFN 5x6 products → easy to design-in solution, no PCB layout change	Power and gardening tools Service robots and automated guided vehicles (AGVs) Telecom power supplies Server power supplies