CYW20706

Overview

AIROC™ CYW20706 Bluetooth® & Bluetooth® LE system on chip

The AIROC™ CYW20706 Bluetooth® & Bluetooth® LE SoC is a Bluetooth® 5.4 core spec compliant device for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW20706 employs high levels of integration to minimize external components, reducing the device footprint and the costs associated with implementing Bluetooth® solutions.

The AIROC™ CYW20706 Bluetooth® & Bluetooth® LE SoC is designed to support a wide spectrum of Bluetooth® use cases for home automation, sensors (medical, home, security, and industrial), lighting, Bluetooth® Mesh, or any Bluetooth® connected IoT application.

AIROC™ CYW20706 Modules

Infineon's AIROC™ CYW20706 Bluetooth® & Bluetooth® LE modules are fully integrated with onboard crystal oscillator, passive components, flash memory, and the CYW20706 system on chip. These highly integrated modules are also globally certified to support fast time-to-market. The AIROC™ CYBT-343151-02, CYBT-333032-02, CYBT-343026-01 and CYBT-353027-02 are supported by the AIROC™ Bluetooth® SDK in ModusToolbox™ software and tools with code examples to support rapid development of embedded Bluetooth® LE applications.

  • Arm® Cortex®-M3 32-bit RISC processor with
  • Embedded ICE-RT debug and SWD interface units
  • 352-KB on-chip RAM

  • Complies with Bluetooth® core specification version 5.2
  • Includes support for BR, EDR, and Bluetooth® LE
  • LE data rate up to 2 Mbps

  • Up to 24 GPIOs
  • I²C, I²S, UART, and PCM interfaces
  • Support for EEPROM and serial flash interfaces
  • Integrated low dropout regulators (LDO)

  1. CYW20706 Product Guide
  2. CYW20706 Bluetooth® SoC for Embedded Wireless Devices Datasheet
  3. Download ModusToolbox™ Bluetooth® SDK
  4. Join the Wireless Community
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