IDDD08G65C6
概要
Infineon Technologies introduces Double DPAK (D-DPAK), the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom. The benefits of the already existing high voltage technology CoolSiC™ Schottky diode 650V G6 is combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies.
特長
- Offers best-in-class VF and FOM Qc x VF
- Improved dv/dt ruggedness
- Easy and effective match with CoolMOS™ 7 SJ MOSFET families
- Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
- Reduced parasitic source inductance improves e iciency and ease-of-use
- Enables higher power density solutions
- Exceeding the highest quality standards
利点
- Enabling highest energy efficiency
- Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
- Reduced parasitic source inductance improves e iciency and ease-of-use
- Enables higher power density solutions
- Exceeding the highest quality standards
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